ALEXANDRIA, Va., July 15 -- United States Patent no. 12,666,602, issued on June 23, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor memory device" was invented by... Read More
ALEXANDRIA, Va., July 15 -- United States Patent no. 12,666,603, issued on June 23, was assigned to NANYA TECHNOLOGY Corp. (New Taipei City, Taiwan). "Semiconductor device with linered contact and me... Read More
ALEXANDRIA, Va., July 15 -- United States Patent no. 12,666,604, issued on June 23, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea). "Semiconductor device and manufacturing metho... Read More
ALEXANDRIA, Va., July 15 -- United States Patent no. 12,666,605, issued on June 23, was assigned to NANYA TECHNOLOGY Corp. (New Taipei City, Taiwan). "Semiconductor structure using lining layer to pr... Read More
ALEXANDRIA, Va., July 15 -- United States Patent no. 12,666,606, issued on June 23, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-Si, South Korea). "Semiconductor memory device and method for f... Read More
ALEXANDRIA, Va., July 15 -- United States Patent no. 12,666,607, issued on June 23, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Gyeonggi-do, South Korea). "Semiconductor device" was invented by Jun... Read More
ALEXANDRIA, Va., July 15 -- United States Patent no. 12,666,608, issued on June 23, was assigned to CHANGXIN MEMORY TECHNOLOGIES INC. (Hefei City, China). "Semiconductor structure, and method for for... Read More
ALEXANDRIA, Va., July 15 -- United States Patent no. 12,666,609, issued on June 23, was assigned to NANYA TECHNOLOGY Corp. (New Taipei City, Taiwan). "Semiconductor device with programmable insulatin... Read More
ALEXANDRIA, Va., July 15 -- United States Patent no. 12,666,610, issued on June 23, was assigned to CXMT Corp. (Hefei City, China). "Semiconductor structure and memory" was invented by Qilong Wu (Hef... Read More
ALEXANDRIA, Va., July 15 -- United States Patent no. 12,666,611, issued on June 23, was assigned to CHENGDU PBM TECHNOLOGY LTD. (Chengdu, China). "Method for manufacturing high-density three-dimensio... Read More